M01600 - SEMI M16 - Specification for Polycrystalline Silicon StdPbc-0714 As low stiffness can occur

As low stiffness can occur with any material

whereby the sample is placed into a platinum or quartz crucible and thermally decomposed

the equipment without exposing the cassette and wafers to outside contamination

The values given in parentheses are for information only

SEMI T7 — Specification for Back Surface Marking of Double-sided Polished Wafers with a Two-Dimensional Matrix Code Symbol

M01600 - SEMI M16 - Specification for Polycrystalline Silicon StdPbc-0714 As low stiffness can occurThis Specification is intended for use in procurement of polycrystalline silicon for growth of electronic grade monocrystalline silicon ingots. Such ingots are sliced into wafers that are subsequently used for the production of semiconductor devices, integrated circuits, and other microelectronic components including microelectromechanical systems (MEMS). This Specification covers requirements for polycrystalline silicon (poly) used to produce single