G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits StdPbc-0616 This system appears to the

This system appears to the equipment to be a 300 mm FOUP (except that only the volume around the middle wafer may be accessible)

SEMI M20-0215 (Reapproved 0421)

a piece of equipment can be seen as a mechanical entity in the factory which plays a role in the manufacturing process

SEMI M66-0706E (editorial revision)

The following areas are to be addressed in this Document:

G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits StdPbc-0616 This system appears to theEvaluation of semiconductor die attachment integrity using the thermal transient techniques as implemented by the Electrical Test Method on either thermal test chips or active devices. Steady state thermal response (or thermal resistance) and thermal transient response of discrete semiconductor devices and integrated circuits are sensitive to the presence of voids in the die attachment material between the semiconductor chip and package. These voids