M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）

7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）

1-1106 (Reapproved 0512)

SEMI E39 — Object Services Standard (OSS)

which provides uniform illumination of the specimen

however the definitions used are subject to interpretation

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized