G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control SEMI E117-1104 (Reapproved 0816)

SEMI E117-1104 (Reapproved 0816)

and description of the SECS-II messages

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and their interchangeability at all mechanical interfaces

This Document defines relation with main part of SEMI E54 including Common Device Model (CDM) and existing Specific Device Models (SDMs)

SEMI F78-0703 (first published)

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control SEMI E117-1104 (Reapproved 0816)This Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a