Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-89079 Manufacturers for spacecraft and space

Manufacturers for spacecraft and space products

BS EN 60664-5:2007 supersedes EN 60664-5:2003

d) performance of specific components of the gas turbine

Sectors implementing microprocessor systems

and durability for its users

Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-89079 Manufacturers for spacecraft and space1 Scope This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the